[1] Y. Q. Zeng, B. Tao, and Z. P. Yin*, “Molecular orientation transformation of pentacene on amorphous SiO2: A computational study on the initial growth stage of physical vapor deposition,” Journal of Crystal Growth, vol. 405, pp. 73-80, Nov, 2014.
[2] Z. X. Liu, Y. A. Huang, Z. P. Yin*, S. Bennati, and P. S. Valvo, “A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints,” International Journal of Adhesion and Adhesives, vol. 54, pp. 112-123, Oct, 2014.
[3] Z. X. Liu, Y. A. Huang, H. M. Liu, J. K. Chen, and Z. P. Yin*, “Reliable Peeling of Ultrathin Die With Multineedle Ejector,” Ieee Transactions on Components Packaging and Manufacturing Technology, vol. 4, no. 9, pp. 1545-1554, Sep, 2014.
[4] Y. A. Huang, Y. Z. Wang, L. Xiao, H. M. Liu, W. T. Dong, and Z. P. Yin*, “Microfluidic serpentine antennas with designed mechanical tunability,” Lab on a Chip, vol. 14, no. 21, pp. 4205-4212, 2014.
[5] Y. A. Huang, Y. Q. Duan, Y. J. Ding, N. B. Bu, Y. Q. Pan, N. S. Lu, and Z. P. Yin*, “Versatile, kinetically controlled, high precision electrohydrodynamic writing of micro/nanofibers,” Scientific Reports, vol. 4, Aug, 2014.
[6] Y. Q. Duan, Y. A. Huang, Z. P. Yin*, N. B. Bu, and W. T. Dong, “Non-wrinkled, highly stretchable piezoelectric devices by electrohydrodynamic direct-writing,” Nanoscale, vol. 6, no. 6, pp. 3289-3295, 2014.
[7] N. B. Bu, Y. A. Huang, Y. Q. Duan, and Z. P. Yin*, “Process Optimization of Mechano-Electrospinning by Response Surface Methodology,” Journal of Nanoscience and Nanotechnology, vol. 14, no. 5, pp. 3464-3472, May, 2014.
[8] G. H. Wu, B. Tao, and Z. P. Yin*, “Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions,” Microelectronics Reliability, vol. 53, no. 12, pp. 2030-2035, Dec, 2013.
[9] Y. Q. Pan, Y. A. Huang, N. B. Bu, and Z. P. Yin*, “Fabrication of Si-nozzles for parallel mechano-electrospinning direct writing,” Journal of Physics D-Applied Physics, vol. 46, no. 25, Jun, 2013.
[10] Z. X. Liu, P. S. Valvo, Y. A. Huang, and Z. P. Yin*, “Cohesive failure analysis of an array of IC chips bonded to a stretched substrate,” International Journal of Solids and Structures, vol. 50, no. 22-23, pp. 3528-3538, Oct, 2013.